Even after 20 years of image processing in coordinate metrology, revolutionary developments are still possible today.  For example, the Raster Scanning HD process presented in 2016 enables previously unknown measuring speeds while increasing accuracy.  To do so, images of the workpiece are recorded at the maximum camera frequency while in motion and are superimposed by a patented method to form an overall image. Large areas are captured quickly at high resolution. This method makes it possible, for example, to completely capture a 7-inch wafer at a very high magnification within a measurement time of just 2 minutes. An image with 256 megapixels is produced, from which the geometric properties of the wafer can be determined. Another application is the measurement of complete cutting edge geometries on hob-cutters. It is possible to measure 32 teeth in a row within 1.5 seconds and analyze them “in image.”