The most important geometrical characteristic is the flatness of the entire wafer surface.
Wafers are also tested for inclusions and surface damage. The measuring speed requirements for process monitoring are sometimes very high.
-
Applications
- 3D free-form workpieces
- Extruded workpieces
- Molds
- Semiconductor workpieces
- Lithographic structures
- Metal-plastic composite workpieces
- Prismatic workpieces
- Punched and bent parts
- Packaging
- Shaft-Hub Connections
- Shafts and Axes
- Workpieces with micro-features
- Optics and Lenses
- Tools with precisely defined cutting edges
- Tools with complex or irregular cutting edges
- Gear wheels
- Cylindrical workpieces
- Industries
- Our products
- Werth service
- About Werth
- Careers
- Foundation
- Publications
- Downloads
